3D Integration Program Director

Location:

(3001) Belgium

Salary:

Negotiable

Type:

Permanent

Main Industry:

Search Information Technology Jobs

Advertiser:

microTECH Global Ltd

Job ID:

131702756

Posted On:

19 March 2025

3D Integration Program Director – Lead Innovation in Telecom & AI
Location: Leuven, Belgium

Are you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? We’re looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond!

What You’ll Do:
– Lead breakthrough projects in AI/CPU, networking, and 3D engineering.
– Design and implement cutting-edge 3D engineering architectures.
– Turn complex ideas into reality by managing risks and executing technical roadmaps.
– Collaborate globally with top industry experts to push the boundaries of 3D technologies.
– Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.

What You Bring:
– PhD in Engineering, Materials Science, or a related field.
– 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.
– Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
– Strong leadership & communication skills to work with top-tier researchers and engineers.
– A problem-solving mindset with the ability to manage complex, high-stakes projects.

Why Join Us?
– Work at the forefront of innovation in AI, 5G, and advanced networking.
– Collaborate with global experts and lead game-changing research.
– Be part of a company driving next-gen digital transformation.

Are you ready to lead the future of 3D integration? Apply now and let’s innovate together!

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