Layout Team Lead

Location:
(11523) Greece
Salary:
market rate
Type:
Permanent
Main Industry:
Search Information Technology Jobs
Advertiser:
microTECH Global Ltd
Job ID:
132027503
Posted On:
24 June 2025

My client leads the smart edge revolution with state of art innovative silicon solution.

Within the Wireless IoT group, we are seeking a talented Analog/RF/mixed Signal Layout Leader to join the Greece team.
About the Role:

In this role you will take part in the development of the cutting-edge future communication technologies including Ultra Low power MIMO Transceivers. You will be part of a dynamic and agile team, responsible for developing the next generations of wireless solutions for Wi-Fi, Bluetooth and UWB within the RF group located in Athens.

Responsibilities:

* Own cross team planning, collaboration and coordination ensuring that team is well-aligned.
* Assures high quality of Analog & Mixed-Signal Layout implementations.
* Reports progress of layout team activities.
* Leads the chip level layout.
* Be responsible for the layout and verification (DRC, LVS, EMIR, Self-Heating) of high-end Analog/RF and mixed-signal blocks. * Supports the layout team and debugging DRC/LVS/EMIR verification results.
* Creates layout documentation reports and participate in layout design reviews.

Requirements:

* BSc, MSc in electrical engineering or equivalent degree, with 6+ years of relevant experience, OR PhD with 3+ years of experience.
* Focus in Analog/RF and Mixed-Signal Integrated Circuits
* Experience in custom layout design, with a focus on CMOS nodes 22nm and below
* Knowledge in analog layout techniques, for matching, parasitic minimizing, low power consumption
* Understanding of electromigration, coupling and crosstalk
* High level of proficiency of guard rings, DNW, trench isolation
* Knowledgeable of advanced process effects such as LOD, WPE, etc.
* Be capable to lead other layout engineers for top-level integration
* Proficiency in Cadence and Siemens DRC/LVS/Extraction and Synopsys Custom Compiler tools
* Excellent communication skills and ability to work with cross-functional teams

Advantage:

* Experience in FinFET technologies (12nm FinFET and below)
* Programming/scripting knowledge in SKILL, Perl, TCL, Shell, and/or Python is a plus
* Chip finishing/sign-off experience – a bonus

If you are interested in learning more about this offer, get in touch! #

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yonnetim

Published by
yonnetim

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