Senior High-Speed Hardware Engineer (SI/PI)

Location:

(R1111) Romania

Salary:

market rate

Type:

Permanent

Main Industry:

Search Engineering Jobs

Advertiser:

microTECH Global Ltd

Job ID:

132990369

Posted On:

15 May 2026

Senior High-Speed Hardware Engineer (SI/PI)

Romania – onsite working required

Our client is seeking an experienced Senior Signal Integrity / Power Integrity (SI/PI) Engineer to join our clients growing hardware team. In this role, you will take ownership of high-speed signal and power integrity across complex electronic systems, from simulation through to lab validation. You will collaborate closely with cross-functional teams to ensure robust electrical performance across silicon, package, and board-level designs.
Key Responsibilities

-Lead and execute Signal Integrity (SI) and Power Integrity (PI) simulations for high-speed designs
-Develop and validate Power Distribution Networks (PDN) and high-speed interfaces
-Collaborate with electrical, system, and packaging engineers to define performance requirements
-Create and implement test plans and validation methodologies
-Perform lab measurements and debugging, ensuring correlation with simulation results
-Analyse data to identify design issues and drive corrective actions
-Manage multiple projects and deliver results within tight timelinesRequired Qualifications

-Bachelor’s degree in Electrical Engineering or a related field
-8+ years of experience in SI/PI engineering or high-speed hardware design
-Strong experience with high-speed interfaces such as:

-LPDDR4 / LPDDR4x
-MIPI
-PCIe Gen 2/3
-10G Ethernet
-Proficiency in industry tools:

-Ansys SIwave / HFSS
-Cadence Sigrity
-Keysight ADS
-Altium
-Solid understanding of:

-System-level timing and loss budgets
-Silicon, package, and PCB interactions
-Hands-on lab experience with:

-Oscilloscopes
-Spectrum analysers
-VNAs and TDR
-Strong communication skills and ability to work across global teamsPreferred Qualifications

-Master’s degree in Electrical Engineering or similar
-Experience with semiconductor packaging and substrate design
-Familiarity with packaging processes (e.g. flip chip, wire bonding)
-Data analysis experience (e.g. Excel, JMP)
-Programming skills (Python, C++)

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