microTECH Global Ltd
- Location:
- (3001) Belgium
- Salary:
- market rate
- Type:
- Permanent
- Main Industry:
- Search Engineering Jobs
- Advertiser:
- microTECH Global Ltd
- Job ID:
- 131997091
- Posted On:
- 13 June 2025
Thermal and Mechanical Modeling & Simulation Engineer
# ; Type: Full-Time, Onsite
# ; Experience: 5–10 years
# ; Location: Leuven, Belgium
Are you passionate about cutting-edge semiconductor technologies and advanced multiphysics simulation? We are looking for an experienced Thermal and Mechanical Modeling & Simulation Engineer to join a highly innovative R&D environment working on next-generation 3DIC designs. This is a unique opportunity to contribute to the development of high-performance semiconductor devices by solving critical challenges in thermal management, mechanical stress, and system reliability.
# ; Your Responsibilities:
-Conduct thermal and mechanical simulations for 3DIC designs, including thermal conduction, expansion, stress analysis, and complex multiphysics coupling (thermo-mechanical, electro-thermal, electromagnetic).
-Use commercial tools and custom in-house solvers to perform simulations, optimize designs, and resolve thermal and structural challenges.
-Lead the refinement of simulation workflows, improve numerical accuracy, and drive tool development.
-Collaborate cross-functionally with design, packaging, and reliability teams to ensure robust, manufacturable solutions.
-Continuously improve modeling methodologies to enhance simulation throughput and engineering efficiency. # ; What You Bring:Technical Skills:
-Strong background in mathematics, thermodynamics, and materials science.
-Expertise in numerical simulation methods (e.g., finite element analysis).
-Hands-on experience with simulation tools like ANSYS, COMSOL, Cadence, or equivalent.
-Familiarity with 3DIC structures and semiconductor packaging challenges.
-Programming knowledge (Python, C++) for tool scripting and automation.Education & Experience:
-Master’s or Ph.D. in Electrical Engineering, Physics, Mechanical Engineering, or a related field.
-5–10 years of relevant industry experience in thermal and mechanical simulation, preferably in semiconductor or packaging environments. # ; Why Join?
-Work at the forefront of semiconductor innovation.
-Tackle complex, real-world engineering challenges.
-Collaborate with world-class experts in an advanced R&D environment.
-Enjoy a competitive salary and opportunities for technical and career growth.
# ; Ready ?
If you’re passionate about simulation, thermal design, and 3DIC technologies, we’d love to hear from you. Submit your CV and let’s shape the future of semiconductor innovation together.
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